By Topic

Failure analysis of 6T SRAM on low-voltage and high-frequency operation

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Ikeda, S. ; Trecenti Technol. Inc., Ibaraki, Japan ; Yoshida, Y. ; Ishibashi, K. ; Mitsui, Y.

Careful analysis of SRAM bit failure at high-frequency operation has been described. Using the nanoprober technique, MOS characteristics of failure bit in actual memory cells had been measured directly. It was confirmed that the drain current of a PMOS was about one order in magnitude smaller and the threshold voltage was about 1 V higher than that for normal bits. A newly developed, unique selective etching technique using hydrazine mixture showed these degradations were caused by local gate depletion, and TEM observation showed the PMOS gate poly-Si of the failure bit had a huge grain. Minimizing grain size of the gate poly-Si is found to be quite effective for improving drain current degradation and suppressing this failure mode.

Published in:

Electron Devices, IEEE Transactions on  (Volume:50 ,  Issue: 5 )