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Flip Chip circuit design for highly integrated transmitter IC for CDMA handset is presented. The RF flip chip implementation uses peripheral I/O bumps pattern and internal ground bumps within the die, directly on the top metal layer. The IC transmitter is designed to deliver 8 dBm in CDMA mode in cellular band, 11 dBm in AMPS mode and 9 dBm in CDMA mode in PCS band at 90, 88, 108 mA, respectively. Results show that flip chip implementation meets or exceeds the wirebond RFIC performance.