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ICPA for highly integrated concurrent dual-band wireless receivers

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3 Author(s)
C. C. Zhang ; Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore ; J. J. Liu ; Y. P. Zhang

A single-feed dual-band integrated circuit package antenna (ICPA) is reported. The ICPA, intended for use in either single-chip or single-package highly integrated concurrent dual-band wireless receivers, is implemented in the format of a cavity-down ceramic ball grid array package of 15×15×1.9 mm3. Results show that the ICPA achieved a frequency ratio of 2.2, return loss bandwidth of 1.67% and gain of -8 dBi at 2.4 GHz, and return loss bandwidth of 0.69% and gain of -2 dBi at 5.25 GHz.

Published in:

Electronics Letters  (Volume:39 ,  Issue: 12 )