By Topic

An investigation of the contact resistance of a commercial elastomer interconnect under thermal and mechanical stresses

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Weifeng Liu ; Hewlett-Packard, Roseville, CA, USA ; Mikyoung Lee ; Pecht, M. ; Martens, R.

The contact behavior of a commercial elastomer interconnect, composed of silicone rubber and silver particles, was evaluated under thermal and mechanical stresses. Its contact resistance demonstrated a linear relationship in a log-log plot with contact force at room temperature; however, a deviation of the trend occurred when temperature was changed. With the interconnect compressed under a constant force, a fluctuation in contact resistance was initiated by a change of temperature. This phenomenon may be attributed to the inherent conduction mechanisms of the elastomer interconnect. The multiple interfaces between metal particles make the contact sensitive to a variety of factors. This sensitivity may have a direct impact on its long-term reliability.

Published in:

Device and Materials Reliability, IEEE Transactions on  (Volume:3 ,  Issue: 2 )