By Topic

Conventional and reciprocal approaches to the inverse dipole localization problem of electroencephalography

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
FInke, S. ; Inst. of Biomed. Eng., Montreal Univ., Que., Canada ; Gulrajani, Ramesh M. ; Gotman, J.

Forward transfer matrices relating dipole source to surface potentials can be determined via conventional or reciprocal approaches. In numerical simulations with a triangulated boundary-element three-concentric-spheres head model, we compare four inverse electroencephalogram (EEG) solutions: those obtained utilizing conventional or reciprocal forward transfer matrices, relating in each case source dipole components to potentials at either triangle centroids or triangle vertices. Single-dipole inverse solutions were obtained using simplex optimization with an additional position constraint limiting solution dipoles to within the brain region. Dipole localization errors are presented in all four cases, for varying dipole eccentricity and two different values of skull conductivity. Both conventional and reciprocal forward transfer matrices yielded inverse dipole solutions of comparable accuracy. Localization errors were low even for highly eccentric source dipoles on account of the nonlinear nature of the single-dipole solution and the position constraint. In the presence of Gaussian noise, both conventional and reciprocal approaches were also found to be equally robust to skull conductivity errors.

Published in:

Biomedical Engineering, IEEE Transactions on  (Volume:50 ,  Issue: 6 )