Cart (Loading....) | Create Account
Close category search window
 

Spreading and solidification of a molten microdrop in the solder jet bumping process

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Young-Soo Yang ; Dept. of Mech. Eng., Chonnam Nat. Univ., Gwangju, South Korea ; Kim, Ho-Young ; Jung-Hoon Chun

This work develops a model to predict the spreading and solidification of solder droplets deposited on a solid pad in the solder jet bumping process. The variational principle is employed to solve the fluid flow and the semi-solid phase is modeled as a non-Newtonian slurry. This modeling greatly saves the computational expenses of conventional numerical procedures. The simulations reveal that the substrate temperature is the single dominant controlling parameter that determines the final bump diameter (or height) when the substrate possesses a high effusivity. When the effusivity of a substrate is relatively low, both the substrate temperature and the droplet temperature at impact play important roles in determining the final bump diameter. Our model can be used in designing the experimental conditions to find the optimal process conditions for a desired bump geometry.

Published in:

Components and Packaging Technologies, IEEE Transactions on  (Volume:26 ,  Issue: 1 )

Date of Publication:

March 2003

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.