By Topic

Smart pumpless loop for micro-channel electronic cooling using flat and enhanced surfaces

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
S. Mukherjee ; Int. Electron. Cooling Alliance, Purdue Univ., West Lafayette, IN, USA ; I. Mudawar

Two-phase cooling of a square simulated electronic device surface of 21.3 mm side was successfully carried out without the need for a pump. This smart, passive cooling system incorporates a self-enhancing and self-sustaining mechanism, wherein the system inherently enhances its cooling capacity by increasing the velocity of the two-phase mixture along the boiling surface when an increase in heat flux is sensed. Other practical attributes of this pumpless loop are small liquid inventory requirements and absence of the incipient boiling temperature drop. It is shown small surface tension and contact angle render dielectric coolants such as FC-72 ideally suited for flow in narrow gaps. These unique properties are responsible for very small bubble size, precluding any appreciable blockage of the replenishment liquid flow even in narrow gaps. Critical heat flux (CHF) was found to generally increase with decreasing boiler gap. CHF for flat, micro-channel (with 0.2 mm rectangular fins) and mini-channel (with 1.98 mm rectangular fins) surfaces was 4.5, 5.9, and 5.7 times greater than for pool boiling from a flat surface for corresponding gaps. A pressure drop model was formulated to predict coolant mass flow rate, boiling surface inlet and exit velocities, and pressure drop components throughout the loop. The model predictions illustrate the pumpless loop's self-sustaining and self-enhancing attributes, and relate CHF trends to those of the two-phase mixture acceleration along the boiling surface.

Published in:

IEEE Transactions on Components and Packaging Technologies  (Volume:26 ,  Issue: 1 )