By Topic

Computer and telecommunications equipment room cooling: a review of literature

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
R. R. Schmidt ; IBM Corp., Poughkeepsie, NY, USA ; H. Shaukatullah

Due to technology compaction, the information technology (IT) industry has seen a large increase in power density and heat dissipation within the footprint of computer and telecommunications hardware. The heat dissipated in these systems is exhausted to the room and the room has to be maintained at acceptable temperatures for reliable operation of the equipment. Cooling computer and telecommunications equipment rooms is becoming a major challenge. This paper reviews the literature dealing with various aspects of cooling computer and telecommunications equipment rooms. Included are papers on experimental work analyzing cooling schemes, numerical modeling, energy saving schemes, natural convection room cooling, forced convection room cooling, cooling raised floor versus nonraised floor type installations, and other related areas.

Published in:

IEEE Transactions on Components and Packaging Technologies  (Volume:26 ,  Issue: 1 )