System Maintenance:
There may be intermittent impact on performance while updates are in progress. We apologize for the inconvenience.
By Topic

SOC CMOS technology for personal Internet products

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

9 Author(s)
Buss, D. ; Texas Instrum. Inc., Dallas, TX, USA ; Evans, B.L. ; Bellay, J. ; Krenik, W.
more authors

Worldwide demand for Personal Internet Products is increasing rapidly, and will shape the directions of CMOS technology in the years ahead. Personal Internet Products are loosely defined in this paper as communication, computing and consumer products, which are enabled by the Internet: cell phones, PDAs, WLANs, Internet audio/video, ADSL, cable modems etc. Personal Internet Products are based on Digital Signal Processing (DSP) and analog functionality. They are made accessible to billions of people around the globe by intense focus on cost through SOC integration. In the Internet Age, Moore's Law will continue to be a technology imperative for the semiconductor industry. But SOC integration will be an additional technology imperative that drives down the cost of Personal Internet Product to mass market levels. SOC integration for Personal Internet Products requires the integration of analog, power analog, RF and memory onto the digital baseband processor, which is fabricated in high density, high performance, low cost digital CMOS technology. This paper describes the challenges and some of the solutions to achieve this vision.

Published in:

Electron Devices, IEEE Transactions on  (Volume:50 ,  Issue: 3 )