Cart (Loading....) | Create Account
Close category search window

Indirect boundary element method applied to generalized microstripline analysis with applications to side-proximity effect in MMIC's

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Li, Keren ; Dept. of Electron. Eng., Univ. of Electro-Commun., Tokyo, Japan ; Fujii, Y.

A novel analysis of the electrical properties of the microstrip-like structures with generalized configuration by means of the indirect boundary element method (BEM) is proposed. In this method, the basic boundary-integral equation is derived by choosing an appropriate fundamental solution and the numerical calculation is done by considering the root-singularity of the boundary distribution on the strip conductor. As an application, the proximity effects in monolithic microwave integrated circuits (MMICs) are calculated. By curve-fitting, the numerical results are expressed in a polynomial suitable for CAD for MMICs

Published in:

Microwave Theory and Techniques, IEEE Transactions on  (Volume:40 ,  Issue: 2 )

Date of Publication:

Feb 1992

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.