Cart (Loading....) | Create Account
Close category search window

Dielectric nanocomposites for integral thin film capacitors: materials design, fabrication and integration issues

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Ramesh, S. ; Dept. of Mater. Sci. & Eng., Cornell Univ., Ithaca, NY, USA ; Shutzberg, B.A. ; Huang, C. ; Jie Gao
more authors

Nanocomposites of organically modified barium titanate (BTO) nanoparticles in an epoxy matrix have been synthesized and evaluated as dielectrics for the fabrication of integral thin film capacitor arrays. Organic modification of the polymer inorganic interface has been used as a design tool to control the cross link density of the polymeric matrix and the interfacial interactions. Impedance spectra generated with model networks has been employed to analyze the experimental data and to model the role of the ceramic core, interface and the polymer matrix in determining the dielectric behavior of the nanocomposites. Stealth decoupling capacitor arrays were fabricated employing BTO-Epoxy nanocomposite thin films as dielectric layer. Capacitor arrays were fabricated by patterning the top electrode in the glass/Al/BTO-epoxy/Al heterostructures employing a photolithographic process and their electrical performance characterized. The role of an organically modified interface in limiting the thermal diffusion of copper metal in the composite thin film has been investigated employing Rutherford backscattering spectroscopy.

Published in:

Advanced Packaging, IEEE Transactions on  (Volume:26 ,  Issue: 1 )

Date of Publication:

Feb. 2003

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.