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Resonance stub effect in a transition from a through via hole to a stripline in multilayer PCBs

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5 Author(s)
T. Kushta ; EMC Eng. Center, NEC Corp., Kanagawa, Japan ; K. Narita ; T. Kaneko ; T. Saeki
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We present results of study of the resonance stub effect occurring in a transition from a through via hole to a stripline in a multilayer printed circuit board (PCB). This effect for via structures including ground vias is estimated by numerical simulations and measurements in the frequency band up to 20 GHz. Ways to alleviate problems in the design of interconnections embedded in multilayer PCBs due to the resonance stub effect and possible applications of the effect in microwave filtering are traced.

Published in:

IEEE Microwave and Wireless Components Letters  (Volume:13 ,  Issue: 5 )