Cart (Loading....) | Create Account
Close category search window
 

Resonance stub effect in a transition from a through via hole to a stripline in multilayer PCBs

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Kushta, T. ; EMC Eng. Center, NEC Corp., Kanagawa, Japan ; Narita, K. ; Kaneko, T. ; Saeki, T.
more authors

We present results of study of the resonance stub effect occurring in a transition from a through via hole to a stripline in a multilayer printed circuit board (PCB). This effect for via structures including ground vias is estimated by numerical simulations and measurements in the frequency band up to 20 GHz. Ways to alleviate problems in the design of interconnections embedded in multilayer PCBs due to the resonance stub effect and possible applications of the effect in microwave filtering are traced.

Published in:

Microwave and Wireless Components Letters, IEEE  (Volume:13 ,  Issue: 5 )

Date of Publication:

May 2003

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.