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Effect of current distribution on the reliability of multi-terminal Cu dual-damascene interconnect trees

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6 Author(s)
Chee Lip Gan ; Singapore-MIT Alliance, Singapore, Singapore ; Thompson, Carl V. ; Pey, Kin Leong ; Wee Kiong Choi
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While the reliability of a dual-damascene via is independent of the number of segments connected to it, it is strongly dependent on the distribution of current among the segments. The most highly stressed segments are not always the least reliable. This behavior for Cu is different than for Al.

Published in:

Reliability Physics Symposium Proceedings, 2003. 41st Annual. 2003 IEEE International

Date of Conference:

30 March-4 April 2003

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