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Factory automation migration experience for foundry fab from 200 mm to 300 mm

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5 Author(s)
L. R. Lin ; Taiwan Semicond. Manuf. Co., Ltd., Hsin-Chu, Taiwan ; H. L. Chu ; C. H. Hung ; Y. C. Lee
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As the semiconductor industry increases interest in 300 mm wafer size transition, Taiwan Semiconductor Manufacturing Company (TSMC) also dedicated to participate in the 300 mm development and mass production. The goal in TSMC is to achieve or exceed the current 200 mm foundry service, which offers leading edge technology, good on-time delivery, and excellent product quality for 300 mm Fabs. To reduce the risk of 300 mm function uncertainly and shorten the development effort for new technology, two-phase development approach had been taken to set-up 300 mm fab. environment. For the detailed TSMC 300 mm fab plan, manufacturing strategy and technology transition will be discussed in this paper.

Published in:

Semiconductor Manufacturing Technology Workshop, 2002

Date of Conference:

10-11 Dec. 2002