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Design and integration of electrical-based dimensional process-window checking infrastructure

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7 Author(s)
K. Y. Y. Doong ; Taiwan Semicond. Manuf. Co., Hsin-Chu, Taiwan ; R. C. J. Wang ; J. C. H. Huang ; S. C. Lin
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The purpose of this work is to provide a design infrastructure for electrical-based dimensional process-window checking. With the aid of the novel test vehicle design platform, the discrepancy among design rule set, test structure design and testing plan can be minimized. Using the function-independent Test Structure Design Intellectual Properties (TSD-IP) provided by this infrastructure, the process-window could be quantified as the electrical testing of test structures. A cross-generation (130 nm-90 nm) test vehicle which focuses on the evaluation of overlay and critical dimension variation across the intra- and inter-photo field is enacted to demonstrate the design framework.

Published in:

Microelectronic Test Structures, 2003. International Conference on

Date of Conference:

17-20 March 2003