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The purpose of this work is to provide a design infrastructure for electrical-based dimensional process-window checking. With the aid of the novel test vehicle design platform, the discrepancy among design rule set, test structure design and testing plan can be minimized. Using the function-independent Test Structure Design Intellectual Properties (TSD-IP) provided by this infrastructure, the process-window could be quantified as the electrical testing of test structures. A cross-generation (130 nm-90 nm) test vehicle which focuses on the evaluation of overlay and critical dimension variation across the intra- and inter-photo field is enacted to demonstrate the design framework.