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Analysis and design of MEMS and embedded components in silicon/LTCC packages using FDTD/MRTD for system-on-package applications (SOP)

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5 Author(s)
Tentzeris, M. ; Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA ; Bushyager, N. ; Laskar, J. ; Zheng, G.
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The FDTD and MRTD full-wave numerical techniques are applied to the modeling and analysis of embedded components, such as MEMS, in silicon packages. Preliminary design rules are derived for minimized-crosstalk transmission lines, for a wideband compact transition, for a MEMS switch and that can be used in practical tuning applications and for a packaging adaptive antenna.

Published in:

Silicon Monolithic Integrated Circuits in RF Systems, 2003. Digest of Papers. 2003 Topical Meeting on

Date of Conference:

11-11 April 2003