By Topic

Endura XP: enabling high 300 mm semiconductor productivity and reliability for manufacturing excellence

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)

The Endura XP is Applied Materials' next-generation 300 mm metal deposition system optimized for high volume production. The system combines a new Factory Interface (FI) with two vacuum wafer handling robots controlled by modern system software. With the Endura XP, chipmakers are able to operate advanced wafer processing sequences (e.g. copper deposition on low x dielectric) with high wafer throughput for low-cost, high yield semiconductor manufacturing. This paper outlines the challenges and requirements for the development of the Endura XP system for optimizing productivity with high throughput and reliability.

Published in:

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI

Date of Conference:

31 March-1 April 2003