Close category search window
 

Novel charge pumping method without using MOS transistor for SOI wafer inspection

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Takami, T. ; Dept. of Electron., Himeji Inst. of Technol., Japan ; Yoshida, H. ; Uchihashi, T. ; Kishino, S.

A novel charge pumping method without using MOS transistors is proposed for obtaining a spatial distribution of interface traps in an SOI wafer. The proposed method can be performed without fabrication processes for the source/drain of MOS transistors that are essential for conventional charge pumping methods. In this method, Schottky contacts are used instead of the normal source/drain diffused layer. The results demonstrate that the proposed method is effective in applying to SOI wafer inspection.

Published in:
Microelectronic Test Structures, 2002. ICMTS 2002. Proceedings of the 2002 International Conference on

Date of Conference: 8-11 April 2002

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.