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Focused Ion Beam (FIB) systems are commonly used to image, repair and modify integrated circuits by cutting holes in passivation to create vias or to selectively break metal tracks. The ion beam can also be used to deposit a metal, such as platinum, to create new connections. These techniques are very useful tools for debugging designs and testing possible changes to the circuit without the expense of new mask sets or silicon. This paper presents test structures to characterise a FIB platinum deposition process. Sheet resistance test structures have been fabricated using a FIB tool and the results of testing these structures are presented. This data will enable resistors with a known value to be fabricated in addition to conducting straps.
Date of Conference: 8-11 April 2002