Non-photolithographic pattern transfer for fabricating arrayed 3D microstructures by chemical anisotropic etching

We propose a new fabrication process for different types of microneedle structures on silicon wafers that does not use photolithography technology. The process consists of anisotropic wet etching and a dicing technology using a dicing saw, and it does not require any expensive plasma-based equipment. We fabricated several arrayed microneedle structures for use in medical and biological applications. The needle height ranged from 100 to 400 /spl mu/m, and the distance between the two needles was 100 /spl mu/m.