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We propose a new fabrication process for different types of microneedle structures on silicon wafers that does not use photolithography technology. The process consists of anisotropic wet etching and a dicing technology using a dicing saw, and it does not require any expensive plasma-based equipment. We fabricated several arrayed microneedle structures for use in medical and biological applications. The needle height ranged from 100 to 400 μm, and the distance between the two needles was 100 μm.
Date of Conference: 19-23 Jan. 2003