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High resolution long array thermal ink jet printhead fabricated by anisotropic wet etching and deep Si RIE

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4 Author(s)
Nayve, R. ; Ink Jet Bus. Group, Fuji Xerox Co. Ltd., Kanagawa, Japan ; Fujii, M. ; Fukugawa, A. ; Murata, M.

A thermal ink jet (TIJ) printhead suitable for high speed and high quality printing has been developed. The printhead has been fabricated by dicing the bonded wafer, which consists of a bubble generating heater plate and a Si channel plate. The Si channel plate consists of an ink chamber and an ink inlet formed by KOH etching, and a nozzle formed by ICP RIE. The nozzle formed by ICP RIE has squeezed structures, which contribute to high-energy efficiency of drop ejector and therefore successful ejection of small ink drop. These two wafers are directly bonded by using electrostatic bonding of full-cured polyimide to Si. With these technologies, we have fabricated a 1" long printhead with 832 nozzles having 800 dots per inch (dpi) resolution and a 4 pl. ink drop volume.

Published in:

Micro Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE The Sixteenth Annual International Conference on

Date of Conference:

19-23 Jan. 2003