By Topic

Experimental investigation on the degradation of BGA solder ball shear strength due to room temperature aging

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Y. -K. Tsui ; Dept. of Mech. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, China ; S. W. R. Lee ; Xingjia Huang

The present study is an experimental investigation on the solder ball reliability of plastic ball grid array (PBGA) packages. Efforts are made to identify the room temperature aging effect on the degradation of solder ball shear strength. The samples are standard PBGA packages with 63Sn-37Pb eutectic solder balls. The specimens are subject to various lengths of room temperature aging after the reflow. After the designated aging period, ball shear tests are conducted to evaluate the solder ball shear strength. The experimental results show that the solder ball shear strength may drop by 10% within three days of room temperature aging. The outcome of the present study leads to a general guideline for the scheduling of solder ball shear tests. As a result, meaningful comparisons of PBGA solder ball shear strength may be achieved.

Published in:

Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on

Date of Conference:

4-6 Dec. 2002