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Factor considerations on the novel surface acoustic wave devices by using piezoelectric materials

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4 Author(s)
I-Tseng Tang ; Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan ; Han-Jan Chen ; Mau-Phon Houng ; Yeong-Her Wang

Due to the increasing variety and capacity of information and communication media, systems of microwave band communication have branched out extensively. Surface acoustic wave (SAW) devices are commonly used in microwave applications, primarily because these devices can be fabricated by using photolithographic processes, and easily integrated into other passive and active devices. SAW devices have been successfully employed for various commercial applications, such as intermediate-frequency (IF) filters for televisions and radio-frequency (RF) filters for mobile telecommunications, using small size and mass-production fabrication processes. We apply the principles of surface acoustic wave and microwave theory, by properly designed circuit with cross-coupled combination, the conventional photolithography and lift-off technique were applied for metal pattern fabrication on the 128°-rotated YX-cut LiNbO3 piezoelectric material substrate.

Published in:

Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on

Date of Conference:

4-6 Dec. 2002