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This paper reports on our work and progress in the simulation and design of the high-performance vacuum devices. Miniaturization and easy manufacturing of vacuum devices have been of interest to the research community of vacuum electronics. The goal of this work is both to explore the performance limits of and to develop necessary design tool for the high-performance vacuum devices that utilize advanced manufacturing techniques. As a result, our simulation and modeling package for the design of the high-performance vacuum devices consists of all three of electromagnetic, structural, and thermal analyses. In this paper, we report on the findings and results of our development of the simulation and modeling package for the design of the high-performance vacuum devices. Electrical characteristics and performance of the vacuum devices are highly geometry dependent. The electromagnetic analysis of these devices is accompanied by mechanical, i.e., structural and thermal, analyses in our simulation and modeling package.