Close category search window
 

Architecture, memory and interface technology integration of an industrial/ academic configurable system-on-chip (CSoC)

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Becker, J. ; Karlsruhe Univ., Germany ; Vorbach, M.

This paper describes the actual status and results of a dynamically configurable system-on-chip (CSoC) integration, consisting of a SPAR C-compatible LEON processor-core, a commercial coarse-grain XPP-array of suitable size from PACT XPP Technologies AG, and application-tailored global/local memory topology with efficient Amba-based communication interfaces. The given adaptive architecture is synthesized within an industrial/academic SoC project onto 0.18 and 0.13 μm UMC CMOS technologies at Universitaet Karlsruhe (TH). Due to exponentially increasing CMOS mask costs, essential aspects for the industry are now adaptivity of SoCs, which can be realized by integrating reconfigurable re-usable hardware parts on different granularities into configurable systems-on-chip (CSoCs).

Published in:
VLSI, 2003. Proceedings. IEEE Computer Society Annual Symposium on

Date of Conference: 20-21 Feb. 2003

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.