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Design and performance evaluation of a compact thermosyphon

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5 Author(s)
Pal, A. ; G. W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA ; Joshi, Y.K. ; Beitelmal, M.H. ; Patel, C.D.
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Thermosyphons are a promising option for cooling of high heat dissipating electronics. In this paper, the first known implementation of a compact two-phase thermosyphon for cooling of a microprocessor in a commercial desktop computer is presented. The implemented thermosyphon involves four components in a loop: an evaporator with a boiling enhancement structure, a rising tube, a condenser and a falling tube. The performance of the thermosyphon with water and PF5060 as working fluids, and the effect of inclination are studied experimentally under laboratory conditions. Experimental observations are also made at actual operating conditions to monitor the thermal behavior with changes in power output of the microprocessor. The inside cabinet of the desktop computer is also numerically simulated to understand the airside performance of the condenser.

Published in:

Components and Packaging Technologies, IEEE Transactions on  (Volume:25 ,  Issue: 4 )

Date of Publication:

Dec 2002

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