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Enhanced electronic system reliability - challenges for temperature prediction

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3 Author(s)

Using telecommunication as an example, it is argued that the electronics industry badly needs a change in attitude toward reliability thinking. The role of thermal design and reliability qualification is discussed in context of current industrial needs for short design cycles and rapid implementation of new technologies. Current and future practices are discussed in the context of newly-emerging reliability standards. Finally, two multi-company projects targeting the improvement of reliability through better temperature-related information are described.

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Components and Packaging Technologies, IEEE Transactions on  (Volume:25 ,  Issue: 4 )