By Topic

New fine metal pattern fabrication method by transplantation

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Kawata, H. ; Coll. of Eng., Osaka Prefecture Univ., Japan ; Ueno, T. ; Yasuda, M. ; Hirai, A.

In this report we will show a new process for a fine metal pattern fabrication and its application to a lateral cantilever fabrication. Fine metal patterns fabricated on a silicon wafer is pressed to and transplanted on the resist film of the another silicon wafer. Before the press a wafer with fine metal patterns is different from a wafer in which devices are contained. Therefore, fine metal patterns can be fabricated by the most effective method without any care of underlying structures.

Published in:

Microprocesses and Nanotechnology Conference, 2002. Digest of Papers. Microprocesses and Nanotechnology 2002. 2002 International

Date of Conference:

6-8 Nov. 2002