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In this report we will show a new process for a fine metal pattern fabrication and its application to a lateral cantilever fabrication. Fine metal patterns fabricated on a silicon wafer is pressed to and transplanted on the resist film of the another silicon wafer. Before the press a wafer with fine metal patterns is different from a wafer in which devices are contained. Therefore, fine metal patterns can be fabricated by the most effective method without any care of underlying structures.