By Topic

Boundary effects on multiplication noise in thin heterostructure avalanche photodiodes: theory and experiment [Al0.6Ga0.4As/GaAs]

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Hayat, M.M. ; Dept. of Electr. & Comput. Eng., Univ. of New Mexico, Albuquerque, NM, USA ; Kwon, Oh-Hyun ; Shuling Wang ; Campbell, Joe C.
more authors

The history-dependent recurrence theory for multiplication noise in avalanche photodiodes (APDs), developed by Hayat et al., is generalized to include inter-layer boundary effects in heterostructure APDs with multilayer multiplication regions. These boundary effects include the initial energy of injected carriers as well as bandgap-transition effects within a multilayer multiplication region. It is shown that the excess noise factor can be significantly reduced if the avalanche process is initiated with an energetic carrier, in which case the initial energy serves to reduce the initial dead space associated with the injected carrier. An excess noise factor reduction up to 40% below the traditional thin-APD limit is predicted for GaAs, depending on the operational gain and the multiplication-region's width. The generalized model also thoroughly characterizes the behavior of dead space as a function of position across layers. This simultaneously captures the effect of the nonuniform electric field as well as the anticipatory nature of inter-layer bandgap-boundary effects.

Published in:

Electron Devices, IEEE Transactions on  (Volume:49 ,  Issue: 12 )