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Signal integrity simulation and analysis in high-speed interconnects by using FDTD

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2 Author(s)
Li Er-ping ; Computational Electromagn. & Electron. Div., Inst. of High Performance Comput., Singapore, Singapore ; Yuan Wei-liang

With the advancements in microelectronics, interest in electromagnetic interference and compatibility in high-speed circuits has greatly increased in the engineering community, and applications of computational electromagnetics to electromagnetic interference and compatibility (EMI/EMC) engineering become an emerging technology. Termination, via, and crosstalk on interconnection lines will raise EMI problems in high-speed circuits and will therefore require more attention during the design phase for signal integrity. This paper presents signal propagation effect analysis on high-speed interconnection lines, between different parts, with the finite-difference time-domain method. The mechanisms and effectiveness of control measures are examined, which could be applied to high-speed circuit design.

Published in:

Electromagnetic Compatibility, 2002 3rd International Symposium on

Date of Conference:

21-24 May 2002