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Solder parameter sensitivity for CSP life-time prediction using simulation-based optimization method

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6 Author(s)

Finite element modeling (FEM) is widely used for estimating the solder joint reliability of electronic packages. However, the solder properties are strongly process and geometry dependent. Even for the same type of solder, measurements conducted by different people at different locations show different results, due to differences in application conditions, benching etc. Those differences may lead to differences in constitutive equations and/or the parameter values. Therefore the effect of the solder parameter variation and parameter sensitivity should be taken into account before a reliable solder fatigue prediction can be made. In this research, a simulation based optimization method is used to investigate the sensitivity of the chosen solder parameters for the solder fatigue prediction using an inelastic strain criterion.

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Electronics Packaging Manufacturing, IEEE Transactions on  (Volume:25 ,  Issue: 4 )