Scheduled System Maintenance:
On Monday, April 27th, IEEE Xplore will undergo scheduled maintenance from 1:00 PM - 3:00 PM ET (17:00 - 19:00 UTC). No interruption in service is anticipated.
By Topic

90 nm generation Cu/CVD low-k (k < 2.5) interconnect technology

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

9 Author(s)
Bao, T.I. ; Taiwan Semicond. Manuf. Co., Hsin-Chu, Taiwan ; Ko, C.C. ; Song, J.Y. ; Li, L.P.
more authors

Eight level Cu/CVD low-k (k<2.5) + one top level Cu/USG 90 nm multilevel interconnection with 0.12/0.12 /spl mu/m for line width/space and 0.13 /spl mu/m for via has been demonstrated for the first time using 193 nm lithography with OPC developed for TSMC 200 mm/300 mm technologies. The 8-level Cu/CVD low-k dual damascenes were constructed by nitrogen-free dielectric layers without middle trench etch stop to achieve keff=2.6. No film delamination was found by film and CMP optimization. Electrical results showed that excellent and thermally stable metal-line Rs and via-chain Rc yields from iso or dense Cu areas and 1M via chains were obtained.

Published in:

Electron Devices Meeting, 2002. IEDM '02. International

Date of Conference:

8-11 Dec. 2002