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New approach to vision-based BGA package inspection

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5 Author(s)
Mei Yu ; Inst. of Circuits & Syst., Ningbo Univ., China ; Gang-Yi Jiang ; Sai-Long He ; Bo-Kang Yu
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Ball grid array (BGA) techniques have developed very fast due to the advantages of more I/O ports, small size, and so on. In this paper, a vision-based algorithm for BGA package inspection is proposed to accurately estimate center and diameters of solder-balls of BGA packages, so that defects of BGA packages, such as missing or extra balls, oversize or undersize balls, over-height or under-height balls, and pitch can be detected for ensuring the quality of BGA packages.

Published in:

Machine Learning and Cybernetics, 2002. Proceedings. 2002 International Conference on  (Volume:2 )

Date of Conference:

2002