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We present a novel fabrication method for a hybrid optoelectronic packaging platform using a combination of passive and active alignment. V-grooves on a silicon optical bench facilitate coarse passive alignment, while on-board thin-film heaters enable final active alignment. The passive-active alignment technique ensures /spl sim/50% peak-coupling efficiency from a semiconductor laser diode with a single-mode conically lensed fiber, making it a low-cost packaging solution appropriate for a variety of optoelectronic modules.
Date of Publication: Feb. 2003