Referenced Items are not available for this document.
We present a novel fabrication method for a hybrid optoelectronic packaging platform using a combination of passive and active alignment. V-grooves on a silicon optical bench facilitate coarse passive alignment, while on-board thin-film heaters enable final active alignment. The passive-active alignment technique ensures /spl sim/50% peak-coupling efficiency from a semiconductor laser diode with a single-mode conically lensed fiber, making it a low-cost packaging solution appropriate for a variety of optoelectronic modules.
Published in:
Photonics Technology Letters, IEEE
(Volume:15
,
Issue:
2
)
Date of Publication: Feb. 2003
- Page(s):
- 299 - 301
- ISSN :
- 1041-1135
- INSPEC Accession Number:
- 7683591
- Digital Object Identifier :
- 10.1109/LPT.2002.806090
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 29 January 2003
- Issue Date :
- Feb. 2003
- Sponsored by :
- IEEE Photonics Society
About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies
A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.
