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Monolithic integration of RF MEMS switches with a diversity antenna on PCB substrate

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6 Author(s)
Cetiner, B.A. ; Electr. Eng. & Comput. Sci. Dept., Univ. of California, Irvine, CA, USA ; Qian, J.Y. ; Chang, H.P. ; Bachman, M.
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A novel process for monolithic integration of RF microelectromechanical system (MEMS) switches with three-dimensional antenna elements on a microwave laminate printed circuit board (PCB) is presented. This process calls for a low-temperature (90°C-170°C) high-density inductively coupled plasma chemical vapor deposition technique that allows the choice of any PCB substrate, such as RO4003-FR4 (εr=3.38, tanδ=0.002), with the desired electrical properties for antenna applications. A two-element diversity antenna system monolithically integrated with RF MEMS switches is designed and demonstrated.

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Microwave Theory and Techniques, IEEE Transactions on  (Volume:51 ,  Issue: 1 )