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Development of low loss organic-micromachined interconnects on silicon at microwave frequencies

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3 Author(s)
Newlin, D.P. ; Dept. of Electr. & Comput. Eng., Clemson Univ., SC, USA ; Pham, A.-V.H. ; Harriss, J.E.

We present the design and development of an ultra-violet (UV) LIGA (a German acronym for electroplating, lithography and molding) micromachining process on silicon substrates at microwave/millimeter wave frequencies. The process employs an ultra-thick negative photoresist SU-8 that can be spin-coated and processed using conventional lithography techniques. Using this process, we have developed micromachined coplanar waveguide (CPW) interconnects on Si substrates. The conductor-backed micromachined CPW on Si (7.2 Ω-cm) achieves a measured attenuation of 0.18 dB/cm at 20 GHz.

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Components and Packaging Technologies, IEEE Transactions on  (Volume:25 ,  Issue: 3 )