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Microwave photo-diode module integrated with a preamplifier IC using a flip-chip bonding technique

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11 Author(s)
Hatta, T. ; Inf. Technol. R&D Center, Mitsubishi Electr. Corp., Hyogo, Japan ; Miyahara, T. ; Okada, N. ; Ota, K.
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We propose a photo-diode module integrated with a pre-amplifier IC using a novel flip-chip bonding technique. An Au stud bump is used as a bonding material, and the waveguide photodiode is directly mounted on an InP hetero bipolar transistor IC.

Published in:

Microwave Photonics, 2002. International Topical Meeting on

Date of Conference:

5-8 Nov. 2002