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The choice of solder joint metallurgy is a key issue especially for the reliability of flip-chip assemblies. Besides the metallurgical systems already widely used and well understood, new materials are emerging as solderable under bump metallization (UBM). For single chip bumping Pd stud bumps form a solid core under the solder layer. These hard core solder bumps are an adequate solution if single dies are available only and the chosen assembly technology is flip chip soldering. The scope of this paper is to summarize the results from aging of lead/tin solder bumps on palladium. The growth of intermetallic and its impact on the mechanical reliability are investigated.