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Packaging for high performance computers

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1 Author(s)
Joy, R. ; IBM Corp., Hopwell Junction, NY, USA

The session will be focused on how packaging technology influences the performance and cost of current and future computers. Alternative packaging designs will be compared, with emphasis on their capabilities, limitations and extendability to future machines.

Published in:

Solid-State Circuits Conference. Digest of Technical Papers. 1978 IEEE International  (Volume:XXI )

Date of Conference:

15-17 Feb. 1978