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A device characterization technique using per-die test structures for mixed-signal integrated circuits

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4 Author(s)
Goel, N. ; Northern Telecom Electron. Ltd., Nepean, Ont., Canada ; Issa, T.Y. ; Siddiqui, A. ; Hobin, G.

The authors present a characterization methodology using per-die test structures to address the need for accurate and reliable product-process models for mixed-signal IC designs. These product-process relationships are critical in generating guardbands and forecasting production yields based on predicted product performance across process variations. Guardband generation, the per-die test structures, and the product-process transformation for analog and digital circuits are discussed

Published in:

Electronic Manufacturing Technology Symposium, 1990 Proceedings, Competitive Manufacturing for the Next Decade. IEMT Symposium, Ninth IEEE/CHMT International

Date of Conference:

1-3 Oct 1990