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Experimental modeling of the etch characteristics of polysilicon in CCl4/He/O2 plasmas

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3 Author(s)
May, G.S. ; Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA ; Huang, J. ; Spanos, C.J.

The objective is to obtain a comprehensive set of statistical models for a variety of process data which accurately represent the behavior of a specific piece of equipment under a wide range of etch conditions. In particular, this study focuses on the control of etch rate, uniformity, and selectivity of n+-doped polysilicon in a CCl4/He/O2 plasma generated by a Lam Research Autotech 490 single-wafer system operating at 13.56 MHz. These responses were monitored under the variation of six input parameters: RF power, pressure, electrode spacing, and the three gas flows. These parameters are fitted to quadratic response surface models. Although the models obtained are generated for a specific process running on a specific piece of equipment, the methodology outlined is general enough to be applied to many semiconductor manufacturing processes

Published in:

Electronic Manufacturing Technology Symposium, 1990 Proceedings, Competitive Manufacturing for the Next Decade. IEMT Symposium, Ninth IEEE/CHMT International

Date of Conference:

1-3 Oct 1990