Close category search window
 

Subcircuit modeling of magnetic cores with hysteresis in PSpice

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Ngo, K.D.T. ; Dept. of Electr. & Comput. Eng., Florida Univ., Gainesville, FL

A methodology to develop subcircuit models of magnetic cores with hysteresis using analog behavioral modeling (ABM) in PSpice is presented. A subcircuit equivalent to the Jiles-Atherton model is developed to model the static ferromagnetic hysteresis. The Hammerstein configuration, which includes a nonlinear static block followed by a linear dynamic block, is further employed to capture the rate dependencies. The nonlinear static block is realized by the Jiles-Atherton model, and linear dynamic block by a low-pass filter. Interface subcircuits are provided to couple the voltage induced by the magnetic flux to the winding model of an inductor or a transformer. The hysteresis-related waveforms predicted by the developed inductor and transformer subcircuit models have been verified experimentally.

Published in:
Aerospace and Electronic Systems, IEEE Transactions on  (Volume:38 ,  Issue: 4 )

Date of Publication: Oct 2002

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.