By Topic

Reflection from a periodically perforated plane using a subsectional current approximation

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Rubin, B.J. ; IBM Corp., Hopewell Junction, NY, USA ; Bertoni, Henry L.

The scattering from a zero thickness plane having finite sheet resistance and perforated periodically with apertures is calculated for arbitrary plane wave illumination. The surface current density within the unit cell is approximated by a finite number of current elements having rooftop spatial dependence. The transverse electric field is expressed in terms of the current, and the electric field boundary condition is satisfied in an integral sense over the conductor, generating a finite dimension matrix equation whose solution is the current density. Since the conductor shape is defined through the locations of subsectional current elements, arbitrary shaped apertures can be handled. The reflection coefficient and current distribution are calculated for square apertures in both perfectly conducting and resistive sheets, and for cross-shaped apertures. Finite resistivity is shown to cause the magnitude of the transverse magnetic (TM) reflection coefficient to decrease more rapidly and its phase to decrease less rapidly, as the angle of incidence approaches glancing. Through detailed plots of the current density, the current crowding around the apertures is made clearly evident.

Published in:

Antennas and Propagation, IEEE Transactions on  (Volume:31 ,  Issue: 6 )