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A simple method is presented for the computation of both the dielectric loss tangent and the conductivity of the metal cladding of printed circuit boards at microwave frequencies. Since the treatment of the cladding in the lamination process affects its conductivity, losses in the dielectric and the metal cannot be measured separately. Thus an analytical means for separating these losses must be employed. The method described accomplishes this by utilizing the different dependence of the two losses on dielectric thickness in thin cavities.