By Topic

Suction vs. Pressure Forced Air Cooling

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)

The cooling of miniaturized equipment is usually handled by forced air flow. An investigation was made of the merits of suction vs pressure cooling, to find an effective cooling design for a certain module assembly. This showed that suction cooling has certain advantages because of the air flow escape from the circuitry section to adjacent spaces. Its air flow pattern provides maximum air accretion at the air exit, which is a critical area. That suction cooling will minimize air temperatures in that area is qualitatively developed and then quantitatively analyzed.

Published in:

Product Engineering and Production, IEEE Transactions on  (Volume:9 ,  Issue: 1 )