Scheduled System Maintenance on May 29th, 2015:
IEEE Xplore will be upgraded between 11:00 AM and 10:00 PM EDT. During this time there may be intermittent impact on performance. For technical support, please contact us at onlinesupport@ieee.org. We apologize for any inconvenience.
By Topic

The Oxidation of Sputtered Tantalum Films and Its Relationship to the Stability of the Electrical Resistance of These Films

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Basseches, H. ; Bell Telephone Labs,Pa

A study of the oxidation of sputtered tantalum films was carried out to help explain the changes in electrical resistance of such films when heated in air at 100°C. A microbalance was used to obtain the oxidation data over a range of temperatures from 100-600°C in pure oxygen at a pressure of 7.6 cm of Hg. The electrical resistance of films was measured over a temperature range up to 200°C. Some results were also obtained when heating was carried out in a vacuum of 10--6mm of Hg. From a consideration of the oxidation data and the electrical resistance data, it appears that oxidative effects based on a simple model of oxide film formation do not play a major role in affecting the stability of the electrical resistance of the films under the test conditions. Oxidative effects at grain boundaries may have more of an influence. However, structural changes, not yet characterized, may be equally important in accounting for the resistance changes.

Published in:

Component Parts, IRE Transactions on  (Volume:8 ,  Issue: 2 )