By Topic

Explosive Bonding of Electrical Interconnections

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Cranston, B.H. ; Western Elec. Co., Inc.

Primary explosive systems, as described, are now being used as a safe and predictable energy source to bond metals on a size scale comparable to microcircuit electrical interconnections. Basic primary explosive reaction characteristics have been analyzed and related to effective bond mechanisms for solid-phase explosive bonding of several metal combinations. Methods and materials systems were devised to accurately deposit a specific quantity and configuration of explosive with predetermined reaction characteristics. This has permitted a significant advance in use of explosive bonding on a microscale. The theoretical explosive bonding mechanism is supported by experimental data. Included in considerations are surface jetting characteristics which influence interface structures and are responsible for removing surface oxides and contaminants. A large variety of similar and dissimilar metal pairs was joined reliably and repeatedly with bond strengths greater than those of the parent metals. Explceive bonding advantages and disadvantages considering materials and bonding equipment requirements are cited.

Published in:

Parts, Hybrids, and Packaging, IEEE Transactions on  (Volume:8 ,  Issue: 3 )