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An experimental study of the thermal impedance characteristics of beam-lead chips is presented. A comparison of the thermal impedance of the 2N2222 and 2N3725 and the beam-lead equivalents of these devices is made. The beam-lead B2T2222 is used as a test vehicle to evaluate the effect of chip area, beam design, substrate temperature, and conformal coatings on the thermal impedance of beam-lead chips. Thermal impedance data for use in designing hybrid circuits with beam-lead devices are included.