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Packaging density for mid-sized computers, personal computers, and other cost-performance equipment has been limited by the need to use available interface or "glue" circuit chips. This makes the system and circuit boards DIP dominated, with a continuing lower circuit density than achieved by bigger main frame systems. Using the percent active silicon area yardstick, various multichip package strengths are explored, showing that there is an increase in board efficiency for easily achievable package constructions that are possible with open plastic premolded packages. Packages are shown that demonstrate that this approach is available whenever the systems manufacturers and the integrated circuit (IC) houses decide to set up the necessary standard packages.