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New approaches are described for increasing the capability of forced gas convection cooling for integrated circuit chips, using an enhanced heat transfer technique and a higher gas flow velocity in a closed-cycle flow. A turbulence promoting fin with low pressure loss has been developed and enhancement of the heat transfer coefficient using gas flow velocities up to 50 m/s is examined using air and helium gas as coolants. 'By applying these techniques, the cooling capability of a package is investigated through the use of prototype equipment. Cooling of an alumina substrate (75 mm square) mounted with 25 chips (8 mm square) can be cooled up to 200 W in an air flow of 20 m/s. In helium gas convection cooling, the allowable heat dissipation increases to 300 W or more, and fan input power decreases to about one-fifth of that needed for air convection cooling. This cooling capability is equal to that of indirect water cooling.